Compliance with standards related to the RoHS directives

 

Regulation chemical substances Threshold values
(RoHS ordinance values)
Analysis methods
(high precision)

Cadmium

Plastic

Metals

Less than 75 ppm



Less than 100 ppm

ICP-OES.ICP-MS.AAS

 

Lead

Plastic

Less than 300 ppm

Metals
(including solder)

Less than 1000 ppm

Mercury

Plastic

Less than 1000 ppm

Hexavalent chromium

Less than 1000 ppm

Diphenylcarbizide absorption spectroscopy

Specified bromine series flame retardants
(PBB PBDE)

Less than 1000 ppm

GC-MS

Cadmium

Packaging
materials
#2

Total less them 100 ppm

ICP-OESAICP-MSAAAS

Lead

Mercury

Hexavalent
chromium

#1. Zinc die casting: Less than 40 ppm Brass: Less than 75 ppm Other: Less than 20 ppm
#2. Packaging materials include ink, paint, pigment, and dye
Under the RoHS directives, the use of lead, cadmium, mercury, hexavalent chromium, and specified bromine
series flame retardants is forbidden.

1. Regarding the two types of "environmentally-friendly printed

circuit boards"

Halogen-free printed circuit boards
1. Bromine-series flame retardants previously used have been changed to phosphor compounds, etc.
which maintain functionality but do not emit poisonous gases (dioxins) when burned.
2. Those using halogen-free ink which have removed the halogens contained in the ink pigment.
Lead-free printed circuit boards
1. Those in which tin, silver, and copper solder has replaced tin and lead solder.
2. Those to which plating has been applied.
3. Water soluble pre-flux items in which tin and lead solder has been replaced by those in which
copper surfaces are protected by organic coatings.
 
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